| 1994 | ||
|---|---|---|
| 2 | William E. Burdick Jr., Wolfgang Daum: High-Yield Multichip Modules Based on Minimal IC Pretest. ITC 1994: 30-40 | |
| 1993 | ||
| 1 | Wolfgang Daum, William E. Burdick Jr., Raymond A. Fillion: Overlay High-Density Interconnect: A Chips-First Multichip Module Technology. IEEE Computer 26(4): 23-29 (1993) | |
| 1 | William E. Burdick Jr. | [1] [2] |
| 2 | Raymond A. Fillion | [1] |