Jianzheng Hu

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2007
1EEJianzheng Hu, Lianqiao Yang, Moo Whan Shin: Mechanism and thermal effect of delamination in light-emitting diode packages. Microelectronics Journal 38(2): 157-163 (2007)

Coauthor Index

1Moo Whan Shin [1]
2Lianqiao Yang [1]

Copyright © Fri Nov 21 17:05:01 2008 by Michael Ley (ley@uni-trier.de)