Songbai Xue

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2006
1 Songbai Xue, Yuxiu Wu, Zongjie Han, Ling Zhang: Effects of lead widths and pitches on reliability of soldered joints and optimum simulation for QFP devices. CGVR 2006: 168-174

Coauthor Index

1Zongjie Han [1]
2Yuxiu Wu [1]
3Ling Zhang [1]

Copyright © Fri Sep 5 16:23:00 2008 by Michael Ley (ley@uni-trier.de)