ISPD 2003: Monterey, CA, USA

Massoud Pedram, Charles J. Alpert (Eds.): Proceedings of the 2003 International Symposium on Physical Design, ISPD 2003, Monterey, CA, USA, April 6-9, 2003. ACM 2003, ISBN 1-58113-650-1

Welcome and Keynote

Raul Camposano:
Keynote Speaker. 3

Placement and Physical Synthesis Deep Dive (invited)

Paul Villarrubia:
Important placement considerations for modern VLSI chips. 6
Ravi Varadarajan:
Convergence of placement technology in physical synthesis: is placement really a point tool? 7

Issues in Timing

Ting-Yuan Wang, Yu-Min Lee, Charlie Chung-Ping Chen:
3D thermal-ADI: an efficient chip-level transient thermal simulator. 10-17
Masanori Hashimoto, Yuji Yamada, Hidetoshi Onodera:
Capturing crosstalk-induced waveform for accurate static timing analysis. 18-23
Chandramouli V. Kashyap, Charles J. Alpert, Frank Liu, Anirudh Devgan:
Closed form expressions for extending step delay and slew metrics to ramp inputs. 24-31
Muzhou Shao, Martin D. F. Wong, Huijing Cao, Youxin Gao, Li-Pen Yuan, Li-Da Huang, Seokjin Lee:
Explicit gate delay model for timing evaluation. 32-38
Murat R. Becer, Ravi Vaidyanathan, Chanhee Oh, Rajendran Panda:
Signal integrity management in an SoC physical design flow. 39-46

From the Trenches (invited)

Leon Stok, John M. Cohn:
There is life left in ASICs. 48-50
Prashant Saxena, Noel Menezes, Pasquale Cocchini, Desmond Kirkpatrick:
The scaling challenge: can correct-by-construction design help? 51-58

Partitioning & Placement

Karthik Rajagopal, Tal Shaked, Yegna Parasuram, Tung Cao, Amit Chowdhary, Bill Halpin:
Timing driven force directed placement with physical net constraints. 60-66
Bo Hu, Malgorzata Marek-Sadowska:
Fine granularity clustering for large scale placement problems. 67-74
Guoqiang Chen, Sachin S. Sapatnekar:
Partition-driven standard cell thermal placement. 75-80
Andrew B. Kahng, Xu Xu:
Local unidirectional bias for smooth cutsize-delay tradeoff in performance-driven bipartitioning. 81-86

Benchmarking

Jason Cong, Michail Romesis, Min Xie:
Optimality, scalability and stability study of partitioning and placement algorithms. 88-94
Saurabh N. Adya, Mehmet Can Yildiz, Igor L. Markov, Paul Villarrubia, Phiroze N. Parakh, Patrick H. Madden:
Benchmarking for large-scale placement and beyond. 95-103

Power Grid Design (invited)

Raymond X. Nijssen, Ed P. Huijbregts:
A complete design for power methodology and flow for large ASICs. 106-108

Lithography and Routing: What's Next? (invited)

Lars Liebmann:
Layout impact of resolution enhancement techniques: impediment or opportunity? 110-117
Hardy Kwok-Shing Leung:
Advanced routing in changing technology landscape. 118-121
Andrew B. Kahng:
Research directions for coevolution of rules and routers. 122-125

Floorplanning

Yan Feng, Dinesh P. Mehta, Hannah Honghua Yang:
Constrained "Modern" Floorplanning. 128-135
Yuchun Ma, Xianlong Hong, Sheqin Dong, Song Chen, Yici Cai, Chung-Kuan Cheng, Jun Gu:
An integrated floorplanning with an efficient buffer planning algorithm. 136-142
Matthew Moe, Herman Schmit:
Floorplanning of pipelined array modules using sequence pairs. 143-150

Routing and Clocking

Hai Zhou:
Efficient Steiner tree construction based on spanning graphs. 152-157
Charles J. Alpert, Gopal Gandham, Milos Hrkic, Jiang Hu, Stephen T. Quay:
Porosity aware buffered steiner tree construction. 158-165
Jeng-Liang Tsai, Tsung-Hao Chen, Charlie Chung-Ping Chen:
Optimal minimum-delay/area zero-skew clock tree wire-sizing in pseudo-polynomial time. 166-173
Bing Lu, Jiang Hu, Gary Ellis, Haihua Su:
Process variation aware clock tree routing. 174-181

Regular Circuit Fabrics (invited)

Chetan Patel, Anthony Cozzie, Herman Schmit, Lawrence T. Pileggi:
An architectural exploration of via patterned gate arrays. 184-189
Jason Cong, Yiping Fan, Xun Yang, Zhiru Zhang:
Architecture and synthesis for multi-cycle communication. 190-196
Bo Hu, Hailin Jiang, Qinghua Liu, Malgorzata Marek-Sadowska:
Synthesis and placement flow for gain-based programmable regular fabrics. 197-203
Fan Mo, Robert K. Brayton:
Fishbone: a block-level placement and routing scheme. 204-209

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