Doug Abbott

	2004
1		Daniel T. Rooney, N. Todd Castello, Mike Cibulsky, Doug Abbott, Dongji Xie: Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectronics Reliability 44(2): 275-285 (2004)

Coauthor Index

1	N. Todd Castello	[1]
2	Mike Cibulsky	[1]
3	Daniel T. Rooney	[1]
4	Dongji Xie	[1]