Gonzalo Amador

	2001
1		Greg Hotchkiss, Gonzalo Amador, Darvin Edwards, Paul Hundt, Les Stark, Roger Stierman, Gail Heinen: Wafer level packaging of a tape flip-chip chip scale packages. Microelectronics Reliability 41(5): 705-713 (2001)

Coauthor Index

1	Darvin Edwards	[1]
2	Gail Heinen	[1]
3	Greg Hotchkiss	[1]
4	Paul Hundt	[1]
5	Les Stark	[1]
6	Roger Stierman	[1]