Xian Tong Chen

	2005
1		Arijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen: Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectronics Reliability 45(9-11): 1443-1448 (2005)

Coauthor Index

1	Rakesh Kumar	[1]
2	Arijit Roy	[1]
3	Cher Ming Tan	[1]