| 2007 | ||
|---|---|---|
| 2 | Hao Yu, Chunta Chu, Lei He: Off-chip Decoupling Capacitor Allocation for Chip Package Co-Design. DAC 2007: 618-621 | |
| 1 | Chunta Chu, Xinyi Zhang, Lei He, Tong Jing: Temperature aware microprocessor floorplanning considering application dependent power load. ICCAD 2007: 586-589 | |
| 1 | Lei He | [1] [2] |
| 2 | Tong Jing | [1] |
| 3 | Hao Yu | [2] |
| 4 | Xinyi Zhang | [1] |