Joanna Ho

	2009
2		Hao Yu, Joanna Ho, Lei He: Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. ACM Trans. Design Autom. Electr. Syst. 14(3): (2009)
	2006
1		Hao Yu, Joanna Ho, Lei He: Simultaneous power and thermal integrity driven via stapling in 3D ICs. ICCAD 2006: 802-808

Coauthor Index

1	Lei He	[1] [2]
2	Hao Yu	[1] [2]