Hoh Huey Jiun

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2006

1 Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006)

	2006
1		Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006)

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