 | 2009 |
|---|
| 4 |       | Syed M. Alam,
Robert E. Jones,
Scott Pozder,
Ankur Jain:
Die/wafer stacking with reciprocal design symmetry (RDS) for mask reuse in three-dimensional (3D) integration technology.
ISQED 2009: 569-575 |
| 2008 |
|---|
| 3 | | Robert E. Jones:
Tutorial 3: Process Technology Development and New Design Opportunities in 3D Integration Technology.
ISQED 2008: 5 |
| 2007 |
|---|
| 2 | | Syed M. Alam,
Robert E. Jones,
Shahid Rauf,
Ritwik Chatterjee:
Inter-Strata Connection Characteristics and Signal Transmission in Three-Dimensional (3D) Integration Technology.
ISQED 2007: 580-585 |
| 1999 |
|---|
| 1 |  | Pong P. Chu,
Robert E. Jones:
Reconfigurable FPGA for Network Performance Evaluation.
PDPTA 1999: 1124-1130 |
