James W. Joyner

	2004
3		James W. Joyner, Payman Zarkesh-Ha, James D. Meindl: Global interconnect design in a three-dimensional system-on-a-chip. IEEE Trans. VLSI Syst. 12(4): 367-372 (2004)
	2001
2		James W. Joyner, Raguraman Venkatesan, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl: Impact of three-dimensional architectures on interconnects in gigascale integration. IEEE Trans. VLSI Syst. 9(6): 922-928 (2001)
	2000
1		James W. Joyner, Payman Zarkesh-Ha, Jeffrey A. Davis, James D. Meindl: Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures. SLIP 2000: 123-127

Coauthor Index

1	Jeffrey A. Davis	[1] [2]
2	James D. Meindl	[1] [2] [3]
3	Raguraman Venkatesan	[2]
4	Payman Zarkesh-Ha	[1] [2] [3]