Robert W. Kay

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2007

1 Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez: Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectronics Reliability 47(1): 132-141 (2007)

	2007
1		Stoyan Stoyanov, Robert W. Kay, Chris Bailey, Marc P. Y. Desmulliez: Computational modelling for reliable flip-chip packaging at sub-100mum pitch using isotropic conductive adhesives. Microelectronics Reliability 47(1): 132-141 (2007)

Coauthor Index

1	Chris Bailey (Christopher Bailey)	[1]
2	Marc P. Y. Desmulliez	[1]
3	Stoyan Stoyanov	[1]