H. S. Lew

	2004
1		Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan: A testing method for assessing solder joint reliability of FCBGA packages. Microelectronics Reliability 44(5): 833-840 (2004)

Coauthor Index

1	H. K. Lim	[1]
2	Woon Theng Saw	[1]
3	Chew Hong Tan	[1]
4	Jinlin Wang	[1]