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DBLP keys2007
2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLNele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans: Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. Microelectronics Reliability 47(2-3): 215-222 (2007)
1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XMLBart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne: Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectronics Reliability 47(2-3): 259-265 (2007)

Coauthor Index

1Eric Beyne [1]
2Mario Gonzalez [1]
3Petar Ratchev [1]
4Inge Schildermans [2]
5Nele Van Steenberge [2]
6Bart Vandevelde [1] [2]
7Geert Willems [2]

Copyright © Wed Dec 9 16:00:12 2009 by Michael Ley (ley@uni-trier.de)