Toshio Nakamura

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2008

2 Toshio Nakamura, Takeo Igarashi: An application-independent system for visualizing user operation history. UIST 2008: 23-32

2004

1 Yu Gu, Toshio Nakamura: Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. Microelectronics Reliability 44(3): 471-483 (2004)

	2008
2		Toshio Nakamura, Takeo Igarashi: An application-independent system for visualizing user operation history. UIST 2008: 23-32
	2004
1		Yu Gu, Toshio Nakamura: Interfacial delamination and fatigue life estimation of 3D solder bumps in flip-chip packages. Microelectronics Reliability 44(3): 471-483 (2004)

Coauthor Index

1 Yu Gu [1]

2 Takeo Igarashi [2]

Colors in the list of coauthors