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 | 2006 | |
|---|---|---|
| 2 |      | Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. Microelectronics Reliability 46(2-4): 367-379 (2006) |
| 1 | | Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006) |
| 1 | Ibrahim Ahmad | [1] [2] |
| 2 | Mohd Khairuddin Md Arshad | [2] |
| 3 | Azman Jalar | [1] [2] |
| 4 | Hoh Huey Jiun | [1] |