 | 2007 |
|---|
| 3 |       | Bart Vandevelde,
Mario Gonzalez,
Paresh Limaye,
Petar Ratchev,
Eric Beyne:
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.
Microelectronics Reliability 47(2-3): 259-265 (2007) |
| 2006 |
|---|
| 2 | | Petar Ratchev,
Serguei Stoukatch,
Bart Swinnen:
Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads.
Microelectronics Reliability 46(8): 1315-1325 (2006) |
| 2003 |
|---|
| 1 | | Hong Meng Ho,
Wai Lam,
Serguei Stoukatch,
Petar Ratchev,
Charles J. Vath,
Eric Beyne:
Direct gold and copper wires bonding on copper.
Microelectronics Reliability 43(6): 913-923 (2003) |
