Herbert Reichl

	2008
14		E. Jung, Dionysios Manessis, A. Neumann, L. Bottcher, T. Braun, J. Bauer, Herbert Reichl, B. Iafelice, F. Destro, R. Gambari: Lamination And Microstructuring Technology for a Bio-Cell Multiwell array CoRR abs/0802.3082: (2008)
13		Robert Hahn, Stefan Wagner, Steffen Krumbholz, Herbert Reichl: Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators CoRR abs/0805.0939: (2008)
	2006
12		Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl: Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics. BSN 2006: 23-26
11		Andre Lissner, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl: Vorhersage von magnetischen Kopplungen in Filterschaltungen. EMV 2006: 173-180
10		Stefan-Peter Weber, André Linde, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl: Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV. EMV 2006: 655-664
9		M. Niedermayer, Stephan Guttowski, R. Thomasius, D. Polityko, K. Schrank, Herbert Reichl: Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. IPSN 2006: 391-398
8		T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl: High-temperature reliability of Flip Chip assemblies. Microelectronics Reliability 46(1): 144-154 (2006)
	2005
7		Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl: Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric. ISWC 2005: 86-91
6		Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl: Characterization of bump arrays at RF/microwave frequencies. Microelectronics Reliability 45(3-4): 551-558 (2005)
5		T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl: Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. Microelectronics Reliability 45(9-11): 1672-1675 (2005)
	2004
4		Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl: Long time reliability study of soldered flip chips on flexible substrates. Microelectronics Reliability 44(2): 309-314 (2004)
3		Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl: Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. Microelectronics Reliability 44(5): 797-803 (2004)
	2002
2		Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl: Bump formation for flip chip and CSP by solder paste printing. Microelectronics Reliability 42(3): 391-398 (2002)
	1999
1		Robert Hahn, Herbert Reichl: Batteries and Power Supplies for Wearable and Ubiquitous Computing. ISWC 1999: 168-169

Coauthor Index

1	Rolf Aschenbrenner	[2] [3] [4] [5] [7] [8] [12]
2	V. Bader	[5] [8]
3	J. Bauer	[14]
4	K.-F. Becker	[5] [8]
5	L. Bottcher	[14]
6	T. Braun	[5] [8] [14]
7	Paradiso Coskina	[2]
8	F. Destro	[14]
9	R. Gambari	[14]
10	Stephan Guttowski	[9] [10] [11]
11	Robert Hahn	[1] [13]
12	Eckart Hoene	[10] [11]
13	B. Iafelice	[14]
14	Werner John	[6] [10] [11]
15	E. Jung	[14]
16	Christine Kallmayer	[4] [7] [12]
17	Joachim Kloeser	[2]
18	M. Koch	[5] [8]
19	Steffen Krumbholz	[13]
20	André Linde	[10]
21	Torsten Linz	[7] [12]
22	Andre Lissner	[11]
23	Dionysios Manessis	[3] [14]
24	Ivan N. Ndip	[6]
25	A. Neumann	[14]
26	M. Niedermayer	[9]
27	Andreas Ostmann	[3]
28	Barbara Pahl	[4]
29	Rainer Patzelt	[3]
30	D. Polityko	[9]
31	K. Schrank	[9]
32	Grit Sommer	[6]
33	R. Thomasius	[9]
34	Stefan Wagner	[13]
35	Stefan-Peter Weber	[10]

Colors in the list of coauthors