 | 2008 |
| 12 |  | Jari Kreku,
Mika Hoppari,
Tuomo Kestilä,
Yang Qu,
Juha-Pekka Soininen,
Kari Tiensyrjä:
Application - Platform Performance Modeling and Evaluation.
FDL 2008: 43-48 |
| 2007 |
| 11 |  | Jari Kreku,
Mika Hoppari,
Kari Tiensyrjä,
Per Andersson:
SystemC workload model generation from UML for performance simulation.
FDL 2007: 204-285 |
| 10 |  | Yang Qu,
Kari Tiensyrjä,
Juha-Pekka Soininen,
Jari Nurmi:
System-Level Design for Partially Reconfigurable Hardware.
ISCAS 2007: 2738-2741 |
| 2006 |
| 9 |  | Jari Kreku,
Yang Qu,
Juha-Pekka Soininen,
Kari Tiensyrjä:
Layered UML Workload and SystemC Platform Models.
FDL 2006: 223-229 |
| 8 |  | Konstantinos Masselos,
Kari Tiensyrjä,
Yang Qu,
Nikos S. Voros,
Miroslav Cupák,
Luc Rijnders,
Marko Pettissalo:
System Level Architecture Exploration for Reconfigurable Systems On Chip.
FPL 2006: 1-6 |
| 2005 |
| 7 |  | Yang Qu,
Kari Tiensyrjä,
Juha-Pekka Soininen:
SystemC-based Design Methodology for Reconfigurable System-on-Chip.
DSD 2005: 364-371 |
| 2004 |
| 6 |  | Kari Tiensyrjä,
Miroslav Cupák,
Kostas Masselos,
Marko Pettissalo:
SystemC and OCAPI-xl Based System-Level Design for Reconfigurable Systems-on-Chip.
FDL 2004: 428-440 |
| 5 |  | Yang Qu,
Kari Tiensyrjä,
Kostas Masselos:
System-Level Modeling of Dynamically Reconfigurable Co-processors.
FPL 2004: 881-885 |
| 2002 |
| 4 |  | Shashi Kumar,
Axel Jantsch,
Mikael Millberg,
Johnny Öberg,
Juha-Pekka Soininen,
Martti Forsell,
Kari Tiensyrjä,
Ahmed Hemani:
A Network on Chip Architecture and Design Methodology.
ISVLSI 2002: 117-124 |
| 1997 |
| 3 |  | Sien-An Ong,
Kari Tiensyrjä,
Lech Józwiak:
Interactive codesign for real-time embedded control systems: task graph generation from SA/VHDL models.
EUROMICRO 1997: 172-181 |
| 1995 |
| 2 |  | Juha-Pekka Soininen,
Tuomo Huttunen,
Kari Tiensyrjä,
Hannu Heusala:
Cosimulation of real-time control systems.
EURO-DAC 1995: 170-175 |
| 1994 |
| 1 |  | Matti Kärkkäinen,
Kari Tiensyrjä,
Matti Weissenfelt:
Boundary Scan Testing Combined with Power Supply Current Monitoring.
EDAC-ETC-EUROASIC 1994: 232-235 |