 | 2007 |
|---|
| 7 |       | Eric Wong,
Sung Kyu Lim:
Whitespace redistribution for thermal via insertion in 3D stacked ICs.
ICCD 2007: 267-272 |
| 6 | | Eric Wong,
Jacob R. Minz,
Sung Kyu Lim:
Decoupling-Capacitor Planning and Sizing for Noise and Leakage Reduction.
IEEE Trans. on CAD of Integrated Circuits and Systems 26(11): 2023-2034 (2007) |
| 2006 |
|---|
| 5 | | Eric Wong,
Sung Kyu Lim:
3D floorplanning with thermal vias.
DATE 2006: 878-883 |
| 4 | | Eric Wong,
Jacob R. Minz,
Sung Kyu Lim:
Decoupling capacitor planning and sizing for noise and leakage reduction.
ICCAD 2006: 395-400 |
| 3 | | Eric Wong,
Jacob R. Minz,
Sung Kyu Lim:
Multi-Objective Module Placement For 3-D System-On-Package.
IEEE Trans. VLSI Syst. 14(5): 553-557 (2006) |
| 2004 |
|---|
| 2 | | Andrew Zalesky,
Hai Le Vu,
Zvi Rosberg,
Eric Wong,
Moshe Zukerman:
Modeling and Performance Evaluation of Optical Burst Switched Networks with Deflection Routing and Wavelength Reservation.
INFOCOM 2004 |
| 2001 |
|---|
| 1 |  | Kwang Mong Sim,
Eric Wong:
Toward market-driven agents for electronic auction.
IEEE Transactions on Systems, Man, and Cybernetics, Part A 31(6): 474-484 (2001) |
