Yiping Wu

	2006
1		Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong: A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qeta. Microelectronics Reliability 46(5-6): 864-872 (2006)

Coauthor Index

1	Han Ding	[1]
2	Bo Tao	[1]
3	You-Lun Xiong	[1]