Esther Wai Ching Yau
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2004
1
EE
Esther Wai Ching Yau,
Jing Feng Gong
,
Philip Chan
: Al surface morphology effect on flip-chip solder bump shear strength.
Microelectronics Reliability 44
(2): 323-331 (2004)
Coauthor
Index
1
Philip Chan
[
1
]
2
Jing Feng Gong
[
1
]
Copyright ©
Fri Sep 5 16:23:00 2008 by
Michael Ley
(
ley@uni-trier.de
)
