Esther Wai Ching Yau

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2004

1 Esther Wai Ching Yau, Jing Feng Gong, Philip Chan: Al surface morphology effect on flip-chip solder bump shear strength. Microelectronics Reliability 44(2): 323-331 (2004)

	2004
1		Esther Wai Ching Yau, Jing Feng Gong, Philip Chan: Al surface morphology effect on flip-chip solder bump shear strength. Microelectronics Reliability 44(2): 323-331 (2004)

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