Volume 36,
Number 1,
1992
- J. C. McGroddy:
Preface.
2-2
- Webster E. Howard:
Thin-film-transistor/liquid crystal display technology-An introduction.
3-10
- Paul M. Alt, Carl G. Powell, Benal L. Owens Jr., Harold Ifill:
A gray-scale addressing technique for thin-film-transistor/liquid crystal displays.
11-22
- Hideo Takano, Shunji Suzuki, Hitoshi Hatoh:
Cell design of gray-scale thin-film-transistor-driven liquid crystal displays.
23-42
- Toshihiko Koseki, Tetsuya Fukunaga, Hidemine Yamanaka, Toshihiro Ueki:
Color filter for 10.4-in.-diagonal 4096-color thin-film-transistor liquid crystal displays.
43-50
- Shui-Chih Alan Lien, Richard A. John:
Lateral field effect in twisted nematic cells.
51-58
- Leslie C. Jenkins, Robert J. Polastre, Ronald R. Troutman, Robert L. Wisnieff:
Functional testing of TFT/LCD arrays.
59-68
- Yue Kuo:
Reactive ion etching technology in thin-film-transistor processing.
69-75
- Yukinobu Fujimoto:
Study of the Vth shift of the thin-film transistor by the bias temperature stress test.
76-82
- Hon-Sum Wong, Ying L. Yao, Eugene S. Schlig:
TDI charge-coupled devices: Design and applications.
83-106
Volume 36,
Number 2,
1992
- Nunzio O. Lipari:
Preface.
138-139
- Gottlieb S. Oehrlein, John F. Rembetski:
Plasma-based dry etching techniques in the silicon integrated circuit technology.
140-157
- Paul M. Fahey, Siegfried R. Mader, Scott R. Stiffler, Rick L. Mohler, J. Daniel Mis, James A. Slinkman:
Stress-induced dislocations in silicon integrated circuits.
158-182
- Tung-Sheng Kuan, Philip E. Batson, Randall M. Feenstra, Alan J. Slavin, Ruud M. Tromp:
Application of electron and ion beam analysis techniques to microelectronics.
183-207
- Wai Lee, Steven E. Laux, Massimo V. Fischetti, Giorgio Baccarani, Antonio Gnudi, Johannes M. C. (Hans) Stork, Jack A. Mandelman, Emmanuel F. Crabbé, Matthew R. Wordeman, Farouk Odeh:
Numerical modeling of advanced semiconductor devices.
208-232
- Gary W. Rubloff, Don T. Bordonaro:
Integrated processing for microelectronics science and technology.
233-276
Volume 36,
Number 3,
1992
- James H. Griesmer:
Preface.
328-328
- Gio Wiederhold, John McCarthy:
Arthur Samuel: Pioneer in Machine Learning.
329-332
- Francesco Antonacci, Cecilia M. Calamani:
Capturing the deep meaning of texts through deduction and inference.
333-346
- Marco A. Casanova, Andrea S. Hemerly, Ramiro A. de T. Guerreiro:
Explaining SLDNF resolution with non-normal defaults.
347-360
- Ramiro A. de T. Guerreiro, Andrea S. Hemerly, Marco A. Casanova:
STORK and PENGUIN: Logic programming systems using general clauses and defaults.
361-374
- Christoph Beierle:
Logic programming with typed unification and its realization on an abstract machine.
375-390
- Yasuo Asakawa, Hideaki Komatsu, Hiroaki Etoh, Toshiyuki Hama, Keiichi Maruyama:
Zephyr: Toward true compiler-based programming in Prolog.
391-408
- Chidanand Apté, Robert Dionne, James H. Griesmer, Maurice Karnaugh, John K. Kastner, Meir Laker, Eric Keener Mays:
An experiment in constructing an open expert system using a knowledge substrate.
409-434
- Thomas Wetter, Ralf Nüse:
Use of natural language for knowledge acquisition: Strategies to cope with semantic and pragmatic variation.
435-468
- Thang N. Nguyen, Harry E. Stephanou:
Topological reasoning about dextrous grasps.
469-486
- Silvano Di Zenzo, Monica Del Buono, Marco Meucci, Aido Spirito:
Optical recognition of hand-printed characters of any size, position, and orientation.
487-502
Volume 36,
Number 4,
1992
- Nicholas M. Donofrio:
Preface.
533-534
- Salvatore A. Calta, John A. deVeer, Edward Loizides, Richard N. Strangwayes:
Enterprise Systems Connection (ESCON) Architecture-System overview.
535-552
- Nancy R. Aulet, David W. Boerstler, George DeMario, Frank D. Ferraiolo, Curtis E. Hayward, Charles D. Heath, Allen L. Huffman, William R. Kelly, Gerald W. Peterson, Daniel J. Stigliani Jr.:
IBM Enterprise Systems multimode fiber optic technology.
553-576
- Joseph C. Elliott, Martin W. Sachs:
The IBM Enterprise Systems Connection (ESCON) Architecture.
577-592
- Christos J. Georgiou, Thor A. Larsen, Peter W. Oakhill, Bijan Salimi:
The IBM Enterprise Systems Connection (ESCON) Director: A dynamic switch for 200Mb/s fiber optic links.
593-616
- John R. Flanagan, Thomas A. Gregg, Daniel F. Casper:
The IBM Enterprise Systems Connection (ESCON) channel-A versatile building block.
617-632
- Richard Cwiakala, Jeffrey D. Haggar, Harry M. Yudenfriend:
MVS Dynamic Reconfiguration Management.
633-646
- John J. Coleman, Clifford B. Meltzer, Jeffrey L. Weiner:
Fiber Distributed Data Interface attachment to System/390.
647-654
- Noshir R. Dhondy, Richard J. Schmalz, Ronald M. Smith Sr., Julian Thomas, Phil C. Yeh:
Coordination of time-of-day clocks among multiple systems.
655-666
- Michael D. Swanson, Christopher Vignola:
MVS/ESA coupled-systems considerations.
667-682
- Ronald M. Smith Sr., Phil C. Yeh:
Integrated Cryptographic Facility of the Enterprise Systems Architecture/390: Design considerations.
683-694
- Donald H. Gibson, Gururaj S. Rao:
Design of the IBM System/390 computer family for numerically intensive applications: An overview for engineers and scientists.
695-712
- John S. Liptay:
Design of the IBM Enterprise System/9000 high-end processor.
713-732
- Son Dao Trong, Klaus Helwig:
A single-chip IBM System/390 floating-point processor in CMOS.
733-750
- Dennis F. Ackerman, Mark H. Decker, Joseph J. Gosselin, Kevin M. Lasko, Michael P. Mullen, Ruth E. Rosa, Ernest V. Valera, Bruce Wile:
Simulation of IBM Enterprise System/9000 Models 820 and 900.
751-764
- C. L. (Jim) Chen, Nandakumar N. Tendolkar, Arthur J. Sutton, M. Y. (Ben) Hsiao, Douglas C. Bossen:
Fault-tolerance design of the IBM Enterprise System/9000 Type 9021 processors.
765-780
- Kevin R. Covi:
Three-loop feedback control of fault-tolerant power supplies in IBM Enterprise System/9000 processors.
781-790
- David J. Delia, Thomas C. Gilgert, Nadia H. Graham, Un-pah Hwang, Paul W. Ing, John C. Kan, Randall G. Kemink, George C. Maling, Robert F. Martin, Kevin P. Moran, Jose R. Reyes, Roger R. Schmidt, Robin A. Steinbrecher:
System cooling design for the water-cooled IBM Enterprise System/9000 processors.
791-804
- Gary F. Goth, Michael L. Zumbrunnen, Kevin P. Moran:
Dual-tapered-piston (DTP) module cooling for IBM Enterprise System/9000 systems.
805-816
Volume 36,
Number 5,
1992
- M. J. Attardo:
Preface.
819-820
- Karen H. Brown, Douglas A. Grose, Russell C. Lange, Tak H. Ning, Paul A. Totta:
Advancing the state of the art in high-performance logic and array technology.
821-828
- Arnold E. Barish, James P. Eckhardt, Mark D. Mayo, Walter A. Svarczkopf, Santosh P. Gaur:
Improved performance of IBM Enterprise System/9000 bipolar logic chips.
829-834
- Robert M. Booth Jr., Kurt A. Tallman, Timothy J. Wiltshire, Pui L. Yee:
A statistical approach to quality control of non-normal lithographical overlay distributions.
835-844
- William L. Guthrie, William J. Patrick, Ernest Levine, Harris C. Jones, Ebrahim A. Mehter, Thomas F. Houghton, George T. Chiu, Michael A. Fury:
A four-level VLSI bipolar metallization design with chemical-mechanical planarization.
845-858
- Paul Bunce, William Chin, Leo Clark, Barry Krumm:
Directory and Trace memory chip with active discharge cell.
859-866
- Kin Chiu, John J. DeFazio, Timothy G. McNamara:
IBM Enterprise System/9000 clock system: A technology and system perspective.
867-876
- Evan E. Davidson, Peter W. Hardin, George A. Katopis, Michael G. Nealon, Leon L. Wu:
Physical and electrical design features of the IBM Enterprise System/9000 circuit module.
877-888
- Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond:
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.
889-904
- John R. Kranik, Joseph J. Fulton, Lo-Soun Su, Steven M. Zimmerman:
Equipment-related advances in the fabrication of glass-ceramic/copper/polyimide substrates.
905-920
- Peter J. Brofman, Sudipta K. Ray, Keith F. Beckham:
Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors.
921-934
- James N. Humenik, James M. Oberschmidt, Leon L. Wu, Scott G. Paull:
Low-inductance decoupling capacitor for the thermal conduction modules of the IBM Enterprise System/9000 processors.
935-942
- Lawrence E. Boone, Mark R. Brinthaupt, John A. Malack, John Pavlik:
Aspects of the electrical design and analyses of the printed circuit boards of the IBM Enterprise System/9000 water-cooled processors.
943-955
Volume 36,
Number 6,
1992
Copyright © Fri Nov 27 19:52:36 2009
by Michael Ley (ley@uni-trier.de)
