IBM Journal of Research and Development, Volume 37, 1993

Volume 37, Number 1, 1993

• Hiroyuki Ono: Architecture and performance of the ESPER-2 hard-disk drive servo writer. 3-11
• James E. Phillips, Stamatis Vassiliadis: Proof of correctness of high-performance 3-1 interlock collapsing ALUs. 12-21
• Alina Deutsch, David W. Dranchak, G. Arjavalingam, Christopher W. Surovic, James K. Tam, Gerard V. Kopcsay, John B. Gillett: Electrical characterization and performance limits of a flexible cable. 22-38

Volume 37, Number 2, 1993

• Jean Horkans: Preface. 83-84
• Hariklia Deligianni, Lubomyr T. Romankiw: In situ surface pH measurement during electrolysis using a rotating pH electrode. 85-96
• Jean Horkans, I.-Chia Hsu Chang, Panayotis C. Andricacos: A rotating ring-disk stripping technique used to study electroplating of Sn-Pb from methane sulfonic acid solutions. 97-106
• John G. Gaudiello, Gerald L. Ballard: Mechanistic insights into metal-mediated electroless copper plating employing hypophosphite as a reducing agent. 107-116
• Rangarajan Jagannathan, Mahadevaiyer Krishnan: Electroless plating of copper at a low pH level. 117-124
• John O. Dukovic: Feature-scale simulation of resist-patterned electrodeposition. 125-142
• Oscar A. Moreno, Robert H. Katyl, Jeffrey D. Jones, Peter A. Moschak: Mass transfer of an impinging jet confined between parallel plates. 143-156
• Kay Keij Kanazawa, Owen R. Melroy: The quartz resonator: Electrochemical applications. 157-172
• Vlasta Brusic, Gerald S. Frankel, Chao-Kyn Hu, Miro M. Plechaty, Geraldine Cogin Schwartz: Corrosion and protection of thin-line conductors in VLSI structures. 173-190
• Alejandro G. Schrott, Gerald S. Frankel: Application of X-ray spectroscopy to the study of electrochemically formed surface oxide films. 191-206
• Madhav Datta: Anodic dissolution of metals at high rates. 207-226
• Hajime Seki: In situ infrared spectroscopy of the electrode - electrolyte interface. 227-242
• James R. White: Conduction mechanisms in contaminant layers on printed circuit boards. 243-248
• Arthur F. Diaz, Jean Guay: Contact charging of organic materials: Ion vs. electron transfer. 249-260

Volume 37, Number 3, 1993

• John M. Warlaumont: Preface. 288-290
• Eberhard Spiller: Early history of X-ray lithography at IBM. 291-298
• Alan D. Wilson: X-ray lithography in IBM, 1980-1992, the development years. 299-318
• Henry I. Smith, Mark L. Schattenburg: X-ray lithography from 500 to 30 nm: X-ray nanolithography. 319-330
• Jerry Z. Y. Guo, Franco Cerrina: Modeling X-ray proximity lithography. 331-350
• Martin N. Wilson, Ailstair I. C. Smith, V. C. Kempson, Martin C. Townsend, Joseph C. Schouten, Robert J. Anderson, A. R. Jorden, Victor P. Suller, Michael W. Poole: The Helios 1 compact superconducting storage ring X-ray source. 351-372
• Chas Archie: Performance of the IBM synchrotron X-ray source for lithography. 373-384
• Jeffrey A. Leavey, L. Grant Lesoine: Design considerations for the IBM X-ray lithography facility. 385-394
• Jerome P. Silverman, Robert P. Rippstein, James M. Oberschmidt: X-ray lithography beamlines in the IBM Advanced Lithography Facility. 395-410
• Timothy R. Groves, John G. Hartley, Hans C. Pfeiffer, Denise Puisto, Donald K. Bailey: Electron beam lithography tool for manufacture of X-ray masks. 411-420
• Patricia G. Blauner, John Mauer: X-ray mask repair. 421-434
• David Seeger: Resist materials and processes for X-ray lithography. 435-448

Volume 37, Number 4, 1993

• Dennis P. Fazzio, Michael A. Moser, Christopher J. Polson, John N. Scheffel: Head actuator dynamics of an IBM 5 1/4-inch disk drive. 479-490
• Brock E. Osborn: Statistical modeling in manufacturing: Adapting a diagnostic tool to real-time applications. 491-506
• Beth Tibbitts: Flexible simulation of a complex semiconductor manufacturing line using a rule-based system. 507-522
• Stephen J. Grotzinger, Rarnesh Srinivasan, Ramakrishna Akella, Srinivas Bollapragada: Component procurement and allocation for products assembled to forecast: Risk-pooling effects. 523-536
• David R. Irvin: Modeling the cost of data communication for multi-node computer networks operating in the United States. 537-546
• Richard J. Eickemeyer, Stamatis Vassiliadis: A load-instruction unit for pipelined processors. 547-564

Volume 37, Number 5, 1993

• Chun K. Lim, Thomas Caulfield, Joseph Benenati: Preface. 582-584
• John S. Corbin: Finite element analysis for Solder Ball Connect (SBC) structural design optimization. 585-596
• Michael D. Ries, Donald R. Banks, David P. Watson, Karl G. Hoebener: Attachment of Solder Ball Connect (SBC) packages to circuit cards. 597-608
• H. Victor Mahaney: Thermal modeling of the infrared reflow process for Solder Ball Connect (SBC). 609-620
• Tien Y. Wu, Yifan Guo, William T. Chen: Thermal-mechanical strain characterization for printed wiring boards. 621-634
• Yifan Guo, Chun K. Lim, William T. Chen, Charles G. Woychik: Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation. 635-648
• Hyung-Chu Choi, Yifan Guo, William LaFontaine, Chun K. Lim: Solder Ball Connect (SBC) assemblies under thermal loading: II. Strain analysis via image processing, and reliability considerations. 649-660

Volume 37, Number 6, 1993

• Peter S. Hauge: Preface. 678-678