International Journal of Manufacturing Technology and Management, Volume 7

Volume 7, Number 1, 2005

• John R. Grandzol, Christian J. Grandzol, Shan T. Rippey:
  An emerging framework for global strategy. 1-19
  
• Jian Wang, De-bi Tsao:
  A configuration study on the relationships between production systems and business strategy in the changing environment. 20-40
  
• Olli-Pekka Hilmola:
  Product mix decisions and production lot sizes. 41-51
  
• Damien Power, Milé Terziovski:
  The process, practice and outcomes of non-financial auditing: five Australian case studies. 52-82
  
• D. Y. Sha, Chao-Yang Liu:
  Decision making for shop floor control integration strategies in wafer fabrication using tabu search-based methodology. 83-103
  

Volume 7, Number 2/3/4, 2005

• M. Ramulu:
  Ultrasonic machining effects on the surface finish and strength of silicon carbide ceramics. 107-126
  
• M. J. Jackson:
  Non-traditional machining using pulsed water jets. 127-141
  
• A. Agrawal, V. K. Jain, K. Muralidhar:
  Experimental determination of viscosity of abrasive flow machining media. 142-156
  
• Sandeep Dhanik, S. S. Joshi, N. Ramakrishnan, P. R. Apte:
  Evolution of EDM process modelling and development towards modelling of the micro-EDM process. 157-180
  
• A. S. Kuar, B. Doloi, B. Bhattacharyya:
  Experimental investigations on Nd: YAG laser cutting of silicon nitride. 181-191
  
• Yue Jiao, Ping Hu, Z. J. Pei, Clyde Treadwell:
  Rotary ultrasonic machining of ceramics: design of experiments. 192-206
  
• S. Sarkar, S. Mitra, B. Bhattacharyya:
  Wire electrical discharge machining of gamma titanium aluminide for optimum process criteria yield in single pass cutting operation. 207-223
  
• Muthukuruman Packirisamy, Ion Stiharu, L. Flores:
  Roughness characterisation of gas phase micromachining process suitable for fabricating silicon based microsystems. 224-245
  
• Vinod Yadava, V. K. Jain, Prakash M. Dixit:
  Temperature distribution in the workpiece due to electro-discharge diamond surface grinding using FEM. 246-267
  
• H. Hocheng, P. S. Kao, S. C. Lin:
  Generation of erosion profile of through hole in electrochemical boring using a stepwise moving electrode. 268-286
  
• R. S. Mulik, Vinod Yadava:
  Thermal stresses during electro-chemical spark machining. 287-307
  
• J. H. Zhang, Y. Qin, Q. H. Zhang, Y. J. Hu, S. F. Ren:
  Numerical control system for the ultrasonic vibration assisted electrical discharge machine tool. 308-317
  
• Z. C. Li, Yue Jiao, Timothy W. Deines, Z. J. Pei, Clyde Treadwell:
  Development of an innovative coolant system for rotary ultrasonic machining. 318-328
  
• H. K. Kansal, Sehijpal Singh, Pradeep Kumar:
  Application of Taguchi method for optimisation of powder mixed electrical discharge machining. 329-341
  
• P. K. Brahmankar, N. Ramakrishnan:
  On the fatigue characteristics of electro-discharge machined alumina particulate reinforced aluminium matrix composites. 342-351
  
• Jinjin Zhou, Guibing Pang, Hui Wang, Wenji Xu:
  Research on pulse electrochemical finishing using a moving cathode. 352-365
  
• P. Hemanth, P. V. Naqash, N. Ramesh Babu:
  A simplified model for predicting the penetration of an abrasive water jet in a piercing operation. 366-380
  
• Q. H. Zhang, J. H. Zhang, S. F. Ren, Z. W. Niu, X. Ai:
  A theoretical model of surface roughness in ultrasonic vibration assisted electrical discharge machining in gas. 381-390
  
• Vinay Sharma, Surender Kumar:
  A study of process parameters for coal cutting under Indian environmental conditions using a hydro jet cutting system. 391-403
  

Volume 7, Number 5/6, 2005

• Liqun Zhu, Imin Kao:
  Computational model for the steady-state elasto-hydrodynamic interaction in wafer slicing process using wiresaw. 407-429
  
• Jeremiah A. Couey, Eric R. Marsh, Byron R. Knapp, R. Ryan Vallance:
  In-process force monitoring for precision grinding semiconductor silicon wafers. 430-440
  
• Libo Zhou, Jun Shimizu, Hiroshi Eda:
  A novel fixed abrasive process: chemo-mechanical grinding technology. 441-454
  
• M. B. Cai, X. P. Li, M. Rahman:
  Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon. 455-466
  
• Muthukkumar S. Kadavasal, Abhijit Chandra, Sutee Eamkajornsiri, Ashraf-F. Bastawros:
  Yield improvement via minimisation of step height non-uniformity in chemical mechanical planarisation (CMP) with pressure and velocity as control variables. 467-489
  
• Libo Zhou, Jun Shimizu, Hiroshi Eda:
  Effects of tool stiffness and infeed scheme on planarisation. (Integrated model for simulation of planarisation process). 490-503
  
• Changxue Wang, Peter Sherman, Abhijit Chandra:
  Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation. 504-529
  
• Lei Dong, John A. Patten, Jimmie A. Miller:
  In-situ infrared detection and heating of metallic phase of silicon during scratching test. 530-539
  
• J. M. Zhang, J. G. Sun:
  Quantitative assessment of subsurface damage depth in silicon wafers based on optical transmission properties. 540-552
  
• Iqbal K. Bansal, Mark Surgent:
  Fabrication of pin diodes using direct-bonded silicon wafers. 553-565
  
• Kee S. Kim, Stephen C. Jones, Tami L. Knotts:
  Selecting and developing suppliers for mass merchandisers. 566-580
  
• Reza Tavakkoli-Moghaddam, Masoud Rabbani, Ali Ghodratnama, P. K. Ahmed:
  Allocation of parts to cells, minimising tardiness and idle time by simulated annealing. 581-593
  

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