Microelectronics Reliability, Volume 49

Volume 49, Number 1, January 2009

Regular papers

Volume 49, Number 2, February 2009

Introductory Invited Paper Research Papers Research Notes

Volume 49, Number 3, March 2009

Special Section - Recent Research Advances in Pb-Free Solders Regular Papers

Volume 49, Number 4, April 2009

Research Papers Research Notes

Volume 49, Number 5, May 2009

Special Section - 2008 Reliability of Compound Semiconductors (ROCS) Workshop Regular Papers

Volume 49, Number 6, June 2009

Special Section - IMAPS-CPMT Poland 2008 Regular Papers

Volume 49, Number 7, July 2009

Review paper Research papers Book review

Volume 49, Number 8, August 2009

Special Section - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008) Regular Papers

Volume 49, Numbers 9-11, September - November 2009

Tutorials Topic A : Quality and Reliability Techniques for Devices and Systems Topic B1 : Characterisation and Modelling of Failure Mechanisms in Silicon technologies and Nanoelectronics (Hot carriers, NBTI, High K gate materials, ...) Topic B2 : Characterisation and Modelling of Failure Mechanisms in Silicon technologies and Nanoelectronics (Low K materials, Cu interconnects, ESD, ...) Topic C1 : Advanced Techniques for failure analysis and Case studies: Electron and Optical Beam Testing (EOBT) Topic C2 : Advanced Techniques for failure analysis and Case studies: new characterisation techniques Topic D1 : Failure Mechanisms in Microwave and High Bandgap Devices Topic D2 : Failure Mechanisms in Photonic Devices Topic E : Packaging, Assemblies, Passive Components and MEMS Topic F : Extreme environments : Power devices, aeronautic and spatial electronics reliability

Volume 49, Number 12, December 2009

Special Section - Electrostatic Discharge Reliability Regular Papers