| 2002 | ||
|---|---|---|
| j1 | T. Alander, S. Nurmi, P. Heino, Eero Ristolainen: Impact of component placement in solder joint reliability. Microelectronics Reliability 42(3): 399-406 (2002) | |
| 1 | P. Heino | |
| 2 | S. Nurmi | |
| 3 | Eero Ristolainen |
Data released under the ODC-BY 1.0 license — See also our legal information page