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 | 2011 | |
|---|---|---|
| j3 |      | A. Aubert, S. Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont: Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. Microelectronics Reliability 51(9-11): 1845-1849 (2011) |
| 2010 | ||
| j2 | | A. Aubert, J. P. Rebrasse, L. Dantas de Morais, Nathalie Labat, Hélène Frémont: Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectronics Reliability 50(9-11): 1688-1691 (2010) |
| 2008 | ||
| j1 | | A. Aubert, L. Dantas de Morais, J. P. Rebrasse: Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations. Microelectronics Reliability 48(8-9): 1144-1148 (2008) |
| 1 | Hélène Frémont | |
| 2 | S. Jacques | |
| 3 | Nathalie Labat | |
| 4 | L. Dantas de Morais | |
| 5 | S. Pétremont | |
| 6 | J. P. Rebrasse |
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