E. Bagerman

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	2010
j1		Hendrik Pieter Hochstenbach, Willem D. van Driel, D. G. Yang, J. J. M. Zaal, E. Bagerman: Designing for reliability using a new Wafer Level Package structure. Microelectronics Reliability 50(4): 528-535 (2010)

Coauthor Index

1	Willem D. van Driel (W. D. van Driel)	[j1]
2	Hendrik Pieter Hochstenbach	[j1]
3	D. G. Yang	[j1]
4	J. J. M. Zaal	[j1]

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