H. J. L. Bressers

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen: Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectronics Reliability 47(2-3): 233-239 (2007)

C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, D. G. Yang, G. Q. Zhang, H. J. L. Bressers: Novel shear tools for viscoelastic characterization of packaging polymers. Microelectronics Reliability 47(2-3): 240-247 (2007)

M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen: Virtual qualification of moisture induced failures of advanced packages. Microelectronics Reliability 47(2-3): 273-279 (2007)

H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang: Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectronics Reliability 47(2-3): 290-294 (2007)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen: Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability 47(2-3): 310-318 (2007)