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 | 2008 | |
|---|---|---|
| j2 |      | Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong Oh: Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling. Microelectronics Reliability 48(1): 83-104 (2008) |
| 2007 | ||
| j1 | | Yoshikuni Nakadaira, Seyoung Jeong, Jongbo Shim, Jaiseok Seo, Sunhee Min, Taeje Cho, Sayoon Kang, Seyong Oh: Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling. Microelectronics Reliability 47(12): 1928-1949 (2007) |
| 1 | Seyoung Jeong | |
| 2 | Sayoon Kang | |
| 3 | Sunhee Min | |
| 4 | Yoshikuni Nakadaira | |
| 5 | Seyong Oh | |
| 6 | Jaiseok Seo | |
| 7 | Jongbo Shim |
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