| 2009 | ||
|---|---|---|
| c1 | Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, David C. Chapman, Douglas C. Oakley, Leonard J. Mahoney, Joseph P. Donnelly, Antonio M. Soares, Vyshnavi Suntharalingam, Robert Berger, V. Bolkhovsky, W. Hu, Bruce D. Wheeler, Craig L. Keast, David C. Shaver: Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits. 3DIC 2009: 1-4 | |
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