Okan Erdogan

John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft: Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. 3DIC 2009: 1-7

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald: Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking. ICCD 2007: 202-207

Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald: Predicting the Performance of a 3D Processor-Memory Chip Stack. IEEE Design & Test of Computers 22(6): 540-547 (2005)

Jong-Ru Guo, Chao You, Michael Chu, Okan Erdogan, Russell P. Kraft, John F. McDonald: A High Speed Reconfigurable Gate Array for Gigahertz Applications. ISVLSI 2005: 124-129

Jong-Ru Guo, Chao You, Michael Chu, Robert W. Heikaus, Kuan Zhou, Okan Erdogan, Jiedong Diao, Bryan S. Goda, Russell P. Kraft, John F. McDonald: The gigahertz FPGA: design consideration and applications. FPGA 2004: 248

Chao You, Jong-Ru Guo, Russell P. Kraft, Michael Chu, Robert W. Heikaus, Okan Erdogan, Peter F. Curran, Bryan S. Goda, Kuan Zhou, John F. McDonald: Gigahertz FPGA by SiGe BiCMOS Technology for Low Power, High Speed Computing with 3-D Memory. FPL 2003: 11-20

John Mayega, Okan Erdogan, Paul M. Belemjian, Kuan Zhou, John F. McDonald, Russell P. Kraft: 3D direct vertical interconnect microprocessors test vehicle. ACM Great Lakes Symposium on VLSI 2003: 141-146