Leo J. Ernst

M. Sadeghinia, Kaspar M. B. Jansen, Leo J. Ernst: Characterization of the viscoelastic properties of an epoxy molding compound during cure. Microelectronics Reliability 52(8): 1711-1718 (2012)

J. de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm: Prediction of cure induced warpage of micro-electronic products. Microelectronics Reliability 50(7): 910-916 (2010)

Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont: A fast moisture sensitivity level qualification method. Microelectronics Reliability 50(9-11): 1654-1660 (2010)

Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, H. Preu, Matthias Stecher: Modeling and characterization of molding compound properties during cure. Microelectronics Reliability 49(8): 872-876 (2009)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen: Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectronics Reliability 47(2-3): 233-239 (2007)

C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, D. G. Yang, G. Q. Zhang, H. J. L. Bressers: Novel shear tools for viscoelastic characterization of packaging polymers. Microelectronics Reliability 47(2-3): 240-247 (2007)

V. Gonda, Kaspar M. B. Jansen, Leo J. Ernst, J. den Toonder, G. Q. Zhang: Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectronics Reliability 47(2-3): 248-251 (2007)

H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang: Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectronics Reliability 47(2-3): 290-294 (2007)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen: Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability 47(2-3): 310-318 (2007)

Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout: Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectronics Reliability 47(9-11): 1483-1491 (2007)

Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang: Characterization of moisture properties of polymers for IC packaging. Microelectronics Reliability 47(9-11): 1685-1689 (2007)

M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel: Measuring the through-plane elastic modulus of thin polymer films in situ. Microelectronics Reliability 47(12): 1983-1988 (2007)

Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst: Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectronics Reliability 47(12): 1989-1996 (2007)

C. Yuan, W. D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, R. A. B. Engelen, Leo J. Ernst, F. van Keulen, G. Q. Zhang: Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability 46(9-11): 1679-1684 (2006)

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi: Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability 43(5): 765-774 (2003)