Eiji Iwata

Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji Chel Bea, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines 2(1): 49-68 (2011)

Takafumi Fukushima, Eiji Iwata, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi: Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature. 3DIC 2010: 1-5

Takafumi Fukushima, Eiji Iwata, Tetsu Tanaka, Mitsumasa Koyanagi: Development of a new self-assembled die bonder to three-dimensionally stack known good dies in batch. 3DIC 2009: 1-4

Brian K. Flachs, Shigehiro Asano, Sang H. Dhong, H. Peter Hofstee, Gilles Gervais, Roy Kim, Tien Le, Peichun Liu, Jens Leenstra, John S. Liberty, Brad W. Michael, Hwa-Joon Oh, Silvia M. Müller, Osamu Takahashi, Koji Hirairi, Atsushi Kawasumi, Hiroaki Murakami, Hiromi Noro, Shoji Onishi, Juergen Pille, Joel Silberman, Suksoon Yong, Akiyuki Hatakeyama, Yukio Watanabe, Naoka Yano, Daniel A. Brokenshire, Mohammad Peyravian, VanDung To, Eiji Iwata: Microarchitecture and implementation of the synergistic processor in 65-nm and 90-nm SOI. IBM Journal of Research and Development 51(5): 529-544 (2007)

Thomas Chen, Ram Raghavan, Jason N. Dale, Eiji Iwata: Cell Broadband Engine Architecture and its first implementation - A performance view. IBM Journal of Research and Development 51(5): 559-572 (2007)