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 | 2012 | |
|---|---|---|
| j2 |      | S. Jacques, A. Caldeira, N. Batut, A. Schellmanns, R. Leroy, L. Gonthier: Lifetime prediction modeling of non-insulated TO-220AB packages with lead-based solder joints during power cycling. Microelectronics Reliability 52(1): 212-216 (2012) |
| 2011 | ||
| j1 | | A. Aubert, S. Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont: Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. Microelectronics Reliability 51(9-11): 1845-1849 (2011) |
| 1 | A. Aubert | |
| 2 | N. Batut | |
| 3 | A. Caldeira | |
| 4 | Hélène Frémont | |
| 5 | L. Gonthier | |
| 6 | Nathalie Labat | |
| 7 | R. Leroy | |
| 8 | S. Pétremont | |
| 9 | A. Schellmanns |
Colors in the list of coauthors
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