- CSB - MetaPress - Google - Bing - Yahoo
 | 2012 | |
|---|---|---|
| j1 |      | J. W. Jang, L. Li, P. Bowles, R. Bonda, D. R. Frear: High-lead flip chip bump cracking on the thin organic substrate in a module package. Microelectronics Reliability 52(2): 455-460 (2012) |
| 2009 | ||
| c2 | | M. H. Bae, B. Otgonbayar, Ghishigjargal, J. W. Jang: A Study on Effective RS Deployment in Mobile WiMAX MMR. FGIT-FGCN 2009: 267-274 |
| 1994 | ||
| c1 | | Bert Van Coile, L. Van Tichelen, Annemie Vorstermans, J. W. Jang, M. Staessen: PROTRAN: a prosody transplantation tool for text-to-speech applications. ICSLP 1994 |
| 1 | M. H. Bae | |
| 2 | R. Bonda | |
| 3 | P. Bowles | |
| 4 | Bert Van Coile | |
| 5 | D. R. Frear | |
| 6 | Ghishigjargal | |
| 7 | L. Li | |
| 8 | B. Otgonbayar | |
| 9 | M. Staessen | |
| 10 | L. Van Tichelen | |
| 11 | Annemie Vorstermans |
Colors in the list of coauthors
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