J. H. J. Janssen

J. J. Koning, S. Lecaudey, E. Spaan, M. Stoutjesdijk, J. H. J. Janssen: Thermal heating within SOI. Microelectronics Reliability 48(8-9): 1505-1508 (2008)

M. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken: Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectronics Reliability 47(2-3): 179-186 (2007)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen: Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectronics Reliability 47(2-3): 233-239 (2007)

M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen: Virtual qualification of moisture induced failures of advanced packages. Microelectronics Reliability 47(2-3): 273-279 (2007)

D. G. Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen: Numerical modeling of warpage induced in QFN array molding process. Microelectronics Reliability 47(2-3): 310-318 (2007)

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi: Prediction and verification of process induced warpage of electronic packages. Microelectronics Reliability 43(5): 765-774 (2003)