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M. Karama

2000 – 2009

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2009
[j3]
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A. Micol, C. Martin, O. Dalverny, Michel Mermet-Guyennet, M. Karama: Reliability of lead-free solder in power module with stochastic uncertainty. Microelectronics Reliability 49(6): 631-641 (2009)
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A. Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, E. Woirgard, O. Dalverny, M. Karama: An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications. Microelectronics Reliability 49(9-11): 1370-1374 (2009)
2007
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T. Lhommeau, X. Perpiñà, C. Martin, R. Meuret, Michel Mermet-Guyennet, M. Karama: Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications. Microelectronics Reliability 47(9-11): 1779-1783 (2007)

Coauthor Index

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