Uwe Kerst

Clemens Helfmeier, Christian Boit, Uwe Kerst: On charge sensors for FIB attack detection. HOST 2012: 128-133

P. Scholz, C. Gallrapp, Uwe Kerst, Ted Lundquist, Christian Boit: Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments. Microelectronics Reliability 50(9-11): 1441-1445 (2010)

Mahyar Boostandoost, Uwe Kerst, Christian Boit: Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC. Microelectronics Reliability 50(9-11): 1899-1902 (2010)

Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted Lundquist, Peter Egger, Christian Boit: Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectronics Reliability 49(9-11): 1158-1164 (2009)

Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted Lundquist: Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Design & Test of Computers 25(3): 250-257 (2008)

Ulrike Kindereit, Christian Boit, Uwe Kerst, Steven Kasapi, Radu Ispasoiu, Roy Ng, William K. Lo: Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology. Microelectronics Reliability 48(8-9): 1322-1326 (2008)

Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted Lundquist: Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectronics Reliability 47(9-11): 1523-1528 (2007)

Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted Lundquist, Bernd Krüger: Backside E-Beam Probing on Nano scale devices. ITC 2007: 1-9

Rudolf Schlangen, Peter Sadewater, Uwe Kerst, Christian Boit: Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node. Microelectronics Reliability 46(9-11): 1498-1503 (2006)

Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit: Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectronics Reliability 45(9-11): 1544-1549 (2005)

Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted Lundquist, Siegfried Pauthner: Impact of back side circuit edit on active device performance in bulk silicon ICs. ITC 2005: 9