| 2008 | ||
|---|---|---|
| j2 | Q. Li, J. F. L. Goosen, J. T. M. van Beek, F. van Keulen, K. L. Phan, G. Q. Zhang: Failure analysis of a thin-film nitride MEMS package. Microelectronics Reliability 48(8-9): 1557-1561 (2008) | |
| 2006 | ||
| j1 | C. Yuan, W. D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, R. A. B. Engelen, Leo J. Ernst, F. van Keulen, G. Q. Zhang: Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability 46(9-11): 1679-1684 (2006) | |
| 1 | J. T. M. van Beek | |
| 2 | Willem D. van Driel (W. D. van Driel) | |
| 3 | R. A. B. Engelen (Roy Engelen) | |
| 4 | Leo J. Ernst (L. J. Ernst) | |
| 5 | J. F. L. Goosen | |
| 6 | Q. Li | |
| 7 | K. L. Phan | |
| 8 | Richard B. R. van Silfhout | |
| 9 | Olaf van der Sluis | |
| 10 | C. Yuan | |
| 11 | G. Q. Zhang (G. Q. (Kouchi) Zhang) |
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