Yi-Shao Lai

C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai: Reliability of micro-interconnects in 3D IC packages. Microelectronics Reliability 53(1): 1 (2013)

Tong Hong Wang, Ching-I. Tsai, Chang-Chi Lee, Yi-Shao Lai: Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. Microelectronics Reliability 53(2): 297-302 (2013)

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee: Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints. Microelectronics Reliability 52(1): 180-189 (2012)

Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai: Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. Microelectronics Reliability 52(2): 301 (2012)

Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai: A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation. Microelectronics Reliability 52(3): 541-558 (2012)

Cheng-Yi Liu, S.-W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai: Reliability of high-power LED packaging and assembly. Microelectronics Reliability 52(5): 761 (2012)

Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai: The performance and fracture mechanism of solder joints under mechanical reliability test. Microelectronics Reliability 52(7): 1428-1434 (2012)

Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang: Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. Microelectronics Reliability 52(11): 2851-2855 (2012)

Michael Mayer, Yi-Shao Lai: Copper Wire Bonding. Microelectronics Reliability 51(1): 1-2 (2011)

Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai: Fine pitch copper wire bonding in high volume production. Microelectronics Reliability 51(1): 13-20 (2011)

Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. Robert Kao: Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. Microelectronics Reliability 51(1): 125-129 (2011)

Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai: Characteristic of copper wire and transient analysis on wirebonding process. Microelectronics Reliability 51(1): 179-186 (2011)

M. Y. Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai: Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectronics Reliability 51(3): 642-648 (2011)

Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai: Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. Microelectronics Reliability 51(8): 1372-1376 (2011)

Ming-Jhang Wu, Hua-Chiang Wen, Shyh-Chi Wu, Ping-Feng Yang, Yi-Shao Lai, Wen-Kuang Hsu, Wen-Fa Wu, Chang-Pin Chou: Evaluating nanotribological behavior of annealing Si_0.8Ge_0.2/Si films. Microelectronics Reliability 51(12): 2223-2227 (2011)

Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai: Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectronics Reliability 51(12): 2263-2273 (2011)

Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa Wu, Chang-Pin Chou: Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate. Microelectronics Reliability 50(1): 63-69 (2010)

Tong Yan Tee, Xuejun Fan, Yi-Shao Lai: Advances in Wafer Level Packaging (WLP). Microelectronics Reliability 50(4): 479-480 (2010)

Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere: Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. Microelectronics Reliability 50(4): 498-506 (2010)

Jiunn Chen, Yi-Shao Lai, Chueh-An Hsieh, Chia Yi Hu: Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations. Microelectronics Reliability 50(4): 522-527 (2010)

Hao-Yuan Chang, Wen-Fung Pan, Meng-Kai Shih, Yi-Shao Lai: Geometric design for ultra-long needle probe card for digital light processing wafer testing. Microelectronics Reliability 50(4): 556-563 (2010)

Bo-Ching He, Hua-Chiang Wen, Meng-Hung Lin, Yi-Shao Lai, Wen-Fa Wu, Chang-Pin Chou: Effect of annealing treatment and nanomechanical properties for multilayer Si_0.8Ge_0.2-Si films. Microelectronics Reliability 50(6): 851-856 (2010)

Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu: Recent research advances in Pb-free solders. Microelectronics Reliability 49(3): 221-222 (2009)

Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan: Alloying modification of Sn-Ag-Cu solders by manganese and titanium. Microelectronics Reliability 49(3): 235-241 (2009)

Jiunn Chen, Yi-Shao Lai: Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases. Microelectronics Reliability 49(3): 264-268 (2009)

S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai: High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. Microelectronics Reliability 49(3): 310-317 (2009)

Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai: Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints. Microelectronics Reliability 49(7): 734-745 (2009)

Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin: Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. Microelectronics Reliability 48(1): 132-139 (2008)

Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh: Effects of different drop test conditions on board-level reliability of chip-scale packages. Microelectronics Reliability 48(2): 274-281 (2008)

Chang-Lin Yeh, Yi-Shao Lai: Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. Microelectronics Reliability 48(2): 282-292 (2008)

Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen: Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering. Microelectronics Reliability 48(3): 389-394 (2008)

Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen: Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. Microelectronics Reliability 48(5): 757-762 (2008)

Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen: Finite element model verification for packaged printed circuit board by experimental modal analysis. Microelectronics Reliability 48(11-12): 1837-1846 (2008)

Yi-Shao Lai, Tong Hong Wang: Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 104-110 (2007)

Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen: Cyclic bending reliability of wafer-level chip-scale packages. Microelectronics Reliability 47(1): 111-117 (2007)

Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen: Empirical correlation between package-level ball impact test and board-level drop reliability. Microelectronics Reliability 47(7): 1127-1134 (2007)

Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen: Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. Microelectronics Reliability 47(8): 1239-1245 (2007)

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu: Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy. Microelectronics Reliability 47(8): 1273-1279 (2007)

Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh: Evaluation of solder joint strengths under ball impact test. Microelectronics Reliability 47(12): 2179-2187 (2007)

Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai: Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. Microelectronics Reliability 47(12): 2188-2196 (2007)

Chang-Lin Yeh, Yi-Shao Lai: Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectronics Reliability 46(2-4): 626-636 (2006)

Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectronics Reliability 46(2-4): 645-650 (2006)

Yi-Shao Lai: On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials. Microelectronics Reliability 46(5-6): 859-863 (2006)

Chang-Lin Yeh, Yi-Shao Lai: Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectronics Reliability 46(5-6): 885-895 (2006)

Yi-Shao Lai, Chin-Li Kao: Characteristics of current crowding in flip-chip solder bumps. Microelectronics Reliability 46(5-6): 915-922 (2006)

Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao: Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability 46(7): 1172-1182 (2006)

Yi-Shao Lai, Chin-Li Kao: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectronics Reliability 46(8): 1357-1368 (2006)

Chang-Lin Yeh, Yi-Shao Lai: Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectronics Reliability 45(2): 371-378 (2005)

Yi-Shao Lai, Tong Hong Wang: Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. Microelectronics Reliability 45(3-4): 575-582 (2005)

Ray-Shyan Wu, Yi-Shao Lai: An Observation on Fractal Characteristics of Individual River Plan Forms. Fractals in the Natural and Applied Sciences 1993: 441-451