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 | 2010 | |
|---|---|---|
| c1 |      | Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, F. Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka: Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC 2010: 1-6 |
| 1 | Léa Di Cioccio | |
| 2 | Laurent Clavelier | |
| 3 | Jérôme Dechamp | |
| 4 | C. Euvrard | |
| 5 | Gweltaz Gaudin | |
| 6 | Pierric Gueguen | |
| 7 | Didier Landru | |
| 8 | Ionut Radu | |
| 9 | Gregory Riou | |
| 10 | Mariam Sadaka | |
| 11 | Thomas Signamarcheix | |
| 12 | Catherine Tempesta |
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