H. S. Lew Coauthor index pubzone.org

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j1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan: A testing method for assessing solder joint reliability of FCBGA packages. Microelectronics Reliability 44(5): 833-840 (2004)

Coauthor Index

1H. K. Lim
[j1]
2Woon Theng Saw
[j1]
3Chew Hong Tan
[j1]
4Jinlin Wang
[j1]
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