Sherry Liu

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	2009
c1		John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft: Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers. 3DIC 2009: 1-7

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