Hua Lu Coauthor index pubzone.org

University of Greenwich, UK

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DBLP keys2011
j6Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov: Integration of analytical techniques in stochastic optimization of microsystem reliability. Microelectronics Reliability 51(5): 936-945 (2011)
2009
j5Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
Hua Lu, Chris Bailey, Chunyan Yin: Design for reliability of power electronics modules. Microelectronics Reliability 49(9-11): 1250-1255 (2009)
2008
j4Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
M. J. Rizvi, Chris Bailey, Hua Lu: Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal 39(9): 1101-1107 (2008)
2005
j3Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu: Study of anisotropic conductive adhesive joint behavior under 3-point bending. Microelectronics Reliability 45(3-4): 589-596 (2005)
2003
j2Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
Chunyan Yin, M. O. Alam, Y. C. Chan, Chris Bailey, Hua Lu: The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. Microelectronics Reliability 43(4): 625-633 (2003)
2002
j1Electronic Edition pubzone.org CiteSeerX Google scholar BibTeX bibliographical record in XML
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan: No-flow underfill flip chip assembly--an experimental and modeling analysis. Microelectronics Reliability 42(8): 1205-1212 (2002)

Coauthor Index

1M. O. Alam
[j2]
2Chris Bailey (Christopher Bailey 0002)
[j6] [j5] [j4] [j3] [j2] [j1]
3Y. C. Chan
[j3] [j2] [j1]
4K. C. Hung
[j1]
5M. J. Rizvi
[j4] [j3]
6Stoyan Stoyanov
[j6] [j1]
7Xiangdong Xue
[j6]
8Chunyan Yin
[j5] [j2]
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