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 | 2008 | |
|---|---|---|
| j1 |      | A. J. Joseph, J. D. Gillis, M. Doherty, P. J. Lindgren, R. A. Previti-Kelly, R. M. Malladi, P.-C. Wang, M. Erturk, H. Ding, E. G. Gebreselasie, M. J. McPartlin, J. Dunn: Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications. IBM Journal of Research and Development 52(6): 635-648 (2008) |
| 1 | H. Ding | |
| 2 | M. Doherty | |
| 3 | J. Dunn | |
| 4 | M. Erturk | |
| 5 | E. G. Gebreselasie | |
| 6 | J. D. Gillis | |
| 7 | A. J. Joseph | |
| 8 | P. J. Lindgren | |
| 9 | M. J. McPartlin | |
| 10 | R. A. Previti-Kelly | |
| 11 | P.-C. Wang |
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