Samson Melamed

Shivam Priyadarshi, T. Robert Harris, Samson Melamed, Carlos Tadeo Ortega Otero, Nikhil Kriplani, Carlos E. Christoffersen, Rajit Manohar, Steven R. Dooley, W. Rhett Davis, Paul D. Franzon, Michael B. Steer: Dynamic electrothermal simulation of three-dimensional integrated circuits using standard cell macromodels. IET Circuits, Devices & Systems 6(1): 35-44 (2012)

Samson Melamed, Thorlindur Thorolfsson, T. Robert Harris, Shivam Priyadarshi, Paul D. Franzon, Michael B. Steer, W. Rhett Davis: Junction-Level Thermal Analysis of 3-D Integrated Circuits Using High Definition Power Blurring. IEEE Trans. on CAD of Integrated Circuits and Systems 31(5): 676-689 (2012)

Shivam Priyadarshi, Jianchen Hu, Won Ha Choi, Samson Melamed, Xi Chen, W. Rhett Davis, Paul D. Franzon: Pathfinder 3D: A flow for system-level design space exploration. 3DIC 2011: 1-8

Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed: 3D Specific Systems: Design and CAD. Asian Test Symposium 2011: 470-473

Paul D. Franzon, W. Rhett Davis, Thorlindur Thorolfsson, Samson Melamed: 3D specific systems design and CAD. ICSAMOS 2011: 326-329

Thorlindur Thorolfsson, Samson Melamed, W. Rhett Davis, Paul D. Franzon: Low-Power Hypercube Divided Memory FFT Engine Using 3D Integration. ACM Trans. Design Autom. Electr. Syst. 16(1): 5 (2010)

Samson Melamed, Thorlindur Thorolfsson, Adi Srinivasan, Edmund Cheng, Paul D. Franzon, William Rhett Davis: Junction-level thermal extraction and simulation of 3DICs. 3DIC 2009: 1-7

Thorlindur Thorolfsson, Samson Melamed, Gary Charles, Paul D. Franzon: Comparative analysis of two 3D integration implementations of a SAR processor. 3DIC 2009: 1-4

Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller: Design and CAD for 3D integrated circuits. DAC 2008: 668-673

Hao Hua, Christopher Mineo, Kory Schoenfliess, Ambarish M. Sule, Samson Melamed, Ravi Jenkal, W. Rhett Davis: Exploring compromises among timing, power and temperature in three-dimensional integrated circuits. DAC 2006: 997-1002