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 | 2011 | |
|---|---|---|
| j2 |      | F. Marcq, P. Demont, Philippe Monfraix, A. Peigney, Ch. Laurent, Tomasz Falat, F. Courtade, T. Jamin: Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives. Microelectronics Reliability 51(7): 1230-1234 (2011) |
| 2009 | ||
| j1 | | Philippe Monfraix, Regis Barbaste, Jean Luc Muraro, Claude Drevon, Jean Louis Cazaux: Quasi hermetic packaging for new generation of spaceborn microwave equipment. Microelectronics Reliability 49(9-11): 1326-1329 (2009) |
| 1 | Regis Barbaste | |
| 2 | Jean Louis Cazaux | |
| 3 | F. Courtade | |
| 4 | P. Demont | |
| 5 | Claude Drevon | |
| 6 | Tomasz Falat | |
| 7 | T. Jamin | |
| 8 | Ch. Laurent | |
| 9 | F. Marcq | |
| 10 | Jean Luc Muraro | |
| 11 | A. Peigney |
Colors in the list of coauthors
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